Low-Temperature Solder Paste

Low Melting Point: Melting point is approximately 138°C, lower than traditional solders, making it ideal for temperature-sensitive electronic components.

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Alloy Composition: SN42/Bi58

Product Features:

Low Melting Point: Melting point is approximately 138°C, lower than traditional solders, making it ideal for temperature-sensitive electronic components.
oHS Compliant: Meets EU RoHS standards, reducing the use of harmful substances.
Excellent Soldering Quality: Low residue, good wettability, and high thermal conductivity, which enhances solder joint reliability.
Applications: Suitable for LEDs and heat dissipation modules, effectively reducing thermal resistance and improving heat dissipation efficiency in LED packaging and heatsink bonding.

Packaging:

Print Type: 500g
Syringe Type: 50g / 100g

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