Lead-Free Solder Paste

Medium-Temperature Solder Paste / Halogen-Free Solder Paste

Melting Point Range: Typically between 180°C to 220°C, suitable for general electronic component soldering and widely used in electronic product manufacturing.

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Alloy Composition: SN/3Ag/0.5Cu

Product Features:

Melting Point Range: Typically between 180°C to 220°C, suitable for general electronic component soldering and widely used in electronic product manufacturing.
Ideal for Electronics: A moderate melting point, higher than low-temperature solder paste but lower than high-temperature solder paste, making it suitable for most electronic components.
Lead-Free SnAgCu Alloy (SAC305): Provides high reliability soldering with optimized performance.
Applications: Suitable for general electronic products, PCB assembly, and other electronic manufacturing fields.

Packaging:

Print Type: 500g
Syringe Type: 50g / 100g

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