Effectively prevents oxidation on solder surfaces, ensuring stable soldering quality in high-temperature and prolonged exposure processes.
Tin powder is a fine powder made from premium tin, known for its good conductivity and corrosion resistance, commonly used in soldering materials and alloy manufacturing.
Medium-temperature solder paste is a soldering material that melts at moderate temperatures (approximately 150–220°C), widely used for surface mounting and soldering of electronic components.
Melting Point Range: Typically between 180°C to 220°C, suitable for general electronic component soldering and widely used in electronic product manufacturing.
SG-1000 SMT Printing Steel Plate Protectant uses an exclusive patented formula.
Low Melting Point: Melting point is approximately 138°C, lower than traditional solders, making it ideal for temperature-sensitive electronic components.
Cleaners are chemical agents designed to remove dirt, grease, or other contaminants, widely used in industrial, manufacturing, and daily cleaning applications.
Solder rod is used in wave soldering processes, made from low-impurity metal alloys.
Solder rod is used in wave soldering processes and is made from low-impurity metal alloys.
Used for soldering components during manual soldering processes, solder wire helps remove oxidation
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