Lead-Based Solder Paste

Lead-based solder paste alloys are primarily used in high-temperature soldering processes, making them ideal for power electronics packaging and semiconductor chip soldering.

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Product Alloy: PB88-PB92.5

Product Features:

High Melting Point: Typically exceeding 280°C, suitable for high-temperature environments.
Excellent Conductivity: Contains lead (Pb) components that enhance the stability and conductivity of the solder joints.
Strong Oxidation Resistance: Ideal for electronic devices requiring prolonged operation, effectively minimizing degradation of solder joints.
Low Porosity: Enhances soldering quality, ensuring the reliability of electronic components.
This type of solder paste is commonly used in high-temperature applications such as power modules, automotive electronics, and industrial equipment, playing a key role in packaging technologies.

Packaging Options:

Print Type: 500g
Syringe Type: 25g / 30g / 50g / 100g

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