High-Temperature Solder Wire

Lead-based solder paste alloys are primarily used in high-temperature soldering processes, making them ideal for power electronics packaging and semiconductor chip soldering.

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Product Alloy: PB88-PB92.5

Product Features:

High Melting Point: Typically exceeding 280°C, suitable for high-temperature environments.
Excellent Conductivity: Contains lead (Pb) components that enhance the stability and conductivity of the solder joints.
Strong Oxidation Resistance: Ideal for electronic devices requiring prolonged operation, effectively minimizing degradation of solder joints.
Low Porosity: Enhances soldering quality, ensuring the reliability of electronic components.This type of solder paste is commonly used in high-temperature applications such as power modules, automotive electronics, and industrial equipment, playing a key role in packaging technologies.

Packaging:

Wire Diameter: 0.8B-2.0B - Net Weight per Box: 10kg
Wire Diameter: 0.3B-0.7B - Net Weight per Box: 5kg

Other Information:
Shelf Life: 2 years, stored at temperatures between 0°C and 40°C.

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