The product surface is free from oxidation, making it suitable for electronic component electroplating. The tin-plated surface is smooth with excellent wetting properties, and the tin layer is uniformly applied.
Aluminum ingot is a metal material made from pure aluminum or recycled aluminum, typically processed with additional elements according to international standards or customer specifications.
Copper Oxide Powder is an important chemical material, primarily composed of copper oxide (CuO).
Copper block is a versatile metal material commonly used in electronics, electrical, and mechanical fields. It has high conductivity and thermal conductivity, effectively transmitting electricity and heat.
Mold release-white epoxy resin is a white, strip-shaped adhesive material used for mold release or lubrication, helping to extend mold lifespan and improve product quality.
High-performance epoxy molding compound offering excellent mechanical strength, thermal stability, and moisture resistance—ideal for semiconductor encapsulation and electronic packaging.
Lead-based solder paste alloys are primarily used in high-temperature soldering processes, making them ideal for power electronics packaging and semiconductor chip soldering.
High-temperature solder paste is a soldering material with a higher melting point (above 230°C), suitable for soldering electronic components that require high-temperature resistance.
Medium-temperature solder paste is a soldering material that melts at moderate temperatures (approximately 150–220°C), widely used for surface mounting and soldering of electronic components.
Melting Point Range: Typically between 180°C to 220°C, suitable for general electronic component soldering and widely used in electronic product manufacturing.
Cleaners are chemical agents designed to remove dirt, grease, or other contaminants, widely used in industrial, manufacturing, and daily cleaning applications.
注射型100克.jpg)
